Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 20, 2007
Patent Application Number
10697941
Date Filed
October 31, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
The object is to provide a lightened semiconductor device and a manufacturing method thereof by pasting a layer to be peeled to various base materials. In the present invention, a layer to be peeled is formed on a substrate, then a seal substrate provided with an etching stopper film is pasted with a binding material on the layer to be peeled, followed by removing only the seal substrate by etching or polishing. The remaining etching stopper film is functioned as a blocking film. In addition, a magnet sheet may be pasted as a pasting member.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
