US Patent 7180172 Circuits, multi-layer circuits, and methods of manufacture thereof
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Patent Inventor Names
Carlos L. Barton0
Murali Sethumadhavan0
Scott D. Kennedy0
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Patent abstract
A dielectric material for use in a circuit material comprises a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (POSS) filler. Such dielectric materials may provide a variety of advantageous properties, especially in high frequency circuits.
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US Patent 07180172 Circuits, multi-layer circuits, and methods of manufacture thereof US Patent 7180172 Circuits, multi-layer circuits, and methods of manufacture thereof
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Patent Number
071801720
Patent Number
71801720
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Patent Jurisdiction
Patent Number
071801720
Date of Patent
February 20, 2007
0Patent Application Number
108734050
Date Filed
June 21, 2004
0Official Website
Patent Primary Examiner
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US Patent 07180172 Circuits, multi-layer circuits, and methods of manufacture thereof
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Is a
Patent jurisdiction
Patent number
07180172
Date of patent
February 20, 2007
Patent application number
10873405
Date Filed
June 21, 2004
Patent primary examiner
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