US Patent 7181837 Plating buss and a method of use thereof
Patent 7181837 was granted and assigned to Micron Technology on February, 2007 by the United States Patent and Trademark Office.
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Patent abstract
The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing and equipment alignment problems. The serpentine plating buss design therefore increases board yield.
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US Patent 07181837 Plating buss and a method of use thereof US Patent 7181837 Plating buss and a method of use thereof
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Patent Number
0718183700
Patent Number
718183700
Edits on 23 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071818370
Date of Patent
February 27, 2007
0Patent Application Number
108618470
Date Filed
June 4, 2004
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071818370
Date of Patent
February 27, 2007
0Patent Application Number
108618470
Date Filed
June 4, 2004
0Official Website
Patent Primary Examiner
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US Patent 07181837 Plating buss and a method of use thereof
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07181837
Date of patent
February 27, 2007
Patent application number
10861847
Date Filed
June 4, 2004
Patent primary examiner
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