Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 27, 2007
Patent Application Number
10903425
Date Filed
July 29, 2004
Patent Primary Examiner
Patent abstract
The polishing composition is suitable for chemical mechanical polishing magnetic, optical, semiconductor or silicon substrates. The polishing composition includes abrasive particles in a liquid media. The abrasive particles have a particle core, the particle core having a hardness and a polymeric shell physisorbed to and encapsulating the particle core. The polymeric shell has a solid structure and a hardness lower than the hardness of the particle core. The abrasive particles have an average particle size of less than or equal to about 2 micrometers dispersed in the liquid media.
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