Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hisao Ise0
Date of Patent
March 6, 2007
0Patent Application Number
110347600
Date Filed
January 14, 2005
0Patent Primary Examiner
Patent abstract
A semiconductor device comprises a semiconductor chip which is mounted on a stage. A plurality of leads are electrically connected with the semiconductor chip. A package encloses the semiconductor chip and a part of the plurality of leads. A first corner lead is provided in the stage and outwardly extends from at least one of vertex portions at four corners of the stage to an exterior of the package.
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