Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 13, 2007
0Patent Application Number
106851860
Date Filed
October 14, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Slitters cut through a first layer of film immediately prior to lamination of the first layer to a second layer of film to form a strip therebetween. The degree of bonding between the first and second layers is adjusted so that the strip can be removed without harming the rest of the film or destroying any barrier properties. The lamination process can utilize extrusion lamination or adhesive lamination to provide a variety of uses: removable coupons, prize disclosures, stickers, and an adhesive re-close strip.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.