Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Takayuki Takahashi0
Hideyo Osanai0
Makoto Namioka0
Date of Patent
March 13, 2007
0Patent Application Number
109644260
Date Filed
October 12, 2004
0Patent Primary Examiner
Patent abstract
In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, a difference in level is provided along the entire circumference of the bonding surface of the ceramic substrate 12 to the metal base plate 16. The difference in level is provided by forming at least one of a rising portion 16a and a groove portion 116b on and in the metal base plate 16.
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