Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Brad Benson0
Date of Patent
March 13, 2007
0Patent Application Number
107593630
Date Filed
January 16, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Embodiments of the present invention provide a flexible circuit at least partially encapsulated by a cover layer. The flexible circuit includes a substrate having one or more openings. One or more electrical conductors are bonded to the top surface of the substrate. A first cover layer is bonded to the top surface of the substrate and to the electrical conductors. A second cover layer is bonded to the bottom surface of the substrate and to the first cover layer through the openings.
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