Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
March 13, 2007
Patent Application Number
10877586
Date Filed
June 25, 2004
Patent Primary Examiner
Patent abstract
Embodiments of the invention provide a microelectronic device having a heat spreader positioned between a chip and substrate to which the chip is electrically connected. For one embodiment of the invention, the heat spreader is a thermal slug having a coefficient of thermal expansion approximately equal to the coefficient of thermal expansion of the chip.
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