Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 13, 2007
Patent Application Number
11265302
Date Filed
November 3, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
Patterned copper structures are fabricated by selectively capping the copper employing selective etching and/or selective electroplating in the presence of a liner material. Apparatus for addressing the problem of an increased resistive path as electrolyte during electroetching and/or electroplating flows from the wafer edge inwards is provided.
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