Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 20, 2007
Patent Application Number
10428509
Date Filed
May 1, 2003
Patent Primary Examiner
Patent abstract
A method for removing polymer containing residues from a semiconductor wafer including metal containing features including providing a semiconductor wafer having a process surface including metal containing features said process surface at least partially covered with polymer containing residues; and, subjecting the semiconductor wafer to a series of cleaning steps including sequentially exposing the process surface to at least one primary solvent and at least one intermediate solvent the at least one intermediate solvent comprising an ammonium nitrate containing solution.
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