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US Patent 7192827 Methods of forming capacitor structures

Patent 7192827 was granted and assigned to Micron Technology on March, 2007 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Current Assignee
Micron Technology
Micron Technology
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7192827
Patent Inventor Names
Leonard Forbes0
Jerome Michael Eldridge0
Kie Y. Ahn0
Date of Patent
March 20, 2007
Patent Application Number
09755673
Date Filed
January 5, 2001
Patent Primary Examiner
‌
Brook Kebede
Patent abstract

The invention includes a method of forming a capacitor structure. A first electrical node is formed, and a layer of metallic aluminum is formed over the first electrical node. Subsequently, an entirety of the metallic aluminum within the layer is transformed into one or more of AlN, AlON, and AlO, with the transformed layer being a dielectric material over the first electrical node. A second electrical node is then formed over the dielectric material. The first electrical node, second electrical node and dielectric material together define at least a portion of the capacitor structure. The invention also pertains to a capacitor structure which includes a first electrical node, a second electrical node, and a dielectric material between the first and second electrical nodes. The dielectric material consists essentially of aluminum, oxygen and nitrogen.

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