Patent attributes
A semiconductor element is formed by forming at least one p-n junction on a semiconductor wafer (1), a recess (8) is formed around the semiconductor element by etching, an insulating film (5) is formed on a surface of the recess, and a metal film (6a) is deposited, by sputtering or vacuum evaporation, on a surface of an exposed semiconductor layer (4) and the insulating film (5) on the semiconductor wafer. And after improving an adhesion between the semiconductor layer and the metal film by a thermal treatment, the metal film on the insulating film is removed selectively by blasting high pressured water on the surface of the semiconductor wafer. Consequently, a mesa semiconductor chip is obtained by cutting the semiconductor wafer under the recess. As a result, an electrode of the mesa semiconductor device obtained by the above method is formed uniformly on a surface of the semiconductor layer and is not formed on the insulating film.
