Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 20, 2007
0Patent Application Number
102830760
Date Filed
October 30, 2002
0Patent Primary Examiner
Patent abstract
The semiconductor device includes a tabular base metal having an insulating layer provided on a bottom surface thereof, and the insulating layer includes a plurality of wiring patterns, each of which is provided with a connecting pad at one end thereof. A semiconductor chip is adhered at a substantial center of the insulating layer with an adhesive. Electrodes provided on a bottom surface of the semiconductor chip are connected to the other ends of the wiring patterns by wire bonding via wires. The semiconductor chip is molded with a resin. The connecting pads are connected to solder balls via an interposer substrate provided with conductors.
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