Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 20, 2007
Patent Application Number
10774520
Date Filed
February 9, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
The invention is based on a method and an apparatus for scanning a semiconductor wafer (1), on-the-fly images of regions on the wafer being acquired using a camera (3). Upon a scan line changeover, a continuously curved displacement track is generated by at least partial superimposition of the relative motions between the wafer (1) and camera (3) in the direction of the scan lines and perpendicular thereto. As a result, time is saved and wafer throughput is increased.
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