Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 27, 2007
Patent Application Number
11180188
Date Filed
July 13, 2005
Patent Primary Examiner
Patent abstract
A method for assembling an electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
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