US Patent 7195541 Endpoint detection system for wafer polishing
Patent 7195541 was granted and assigned to Strasbaugh on March, 2007 by the United States Patent and Trademark Office.
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Patent abstract
An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact couplings such inductive coupling or optical couplings after being converted into signal formats enabling non-contact transmission.
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US Patent 07195541 Endpoint detection system for wafer polishing US Patent 7195541 Endpoint detection system for wafer polishing
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Patent Number
0719554100
Patent Number
719554100
Edits on 31 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071955410
Date of Patent
March 27, 2007
0Patent Application Number
114437880
Date Filed
May 30, 2006
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071955410
Date of Patent
March 27, 2007
0Patent Application Number
114437880
Date Filed
May 30, 2006
0Official Website
Patent Primary Examiner
Edits on 8 Jun, 2022
Golden AI
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Edits on 20 Nov, 2021
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US Patent 07195541 Endpoint detection system for wafer polishing
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07195541
Date of patent
March 27, 2007
Patent application number
11443788
Date Filed
May 30, 2006
Patent primary examiner
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