Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 27, 2007
Patent Application Number
10728671
Date Filed
December 5, 2003
Patent Citations Received
Patent Primary Examiner
Patent abstract
A light emitting assembly includes a metal substrate for dissipating heat from the assembly. The metal substrate includes an electrically insulating layer or coating on at least one side. Circuit traces are applied to the electrically insulating layer using either thick or thin film techniques. At least the ends of the circuit traces include a metallic section to which leads of light emitting elements are soldered or wire-bonded. A metallic section is provided adjacent the light emitting element to transfer heat to the underlying substrate and/or to reflect light from the element away from the substrate. A clear finish retards tarnishing of the reflecting metallic section.
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