Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Toshio Sugawa0
Yoshihisa Takase0
Date of Patent
April 3, 2007
Patent Application Number
10250871
Date Filed
October 30, 2002
Patent Primary Examiner
Patent abstract
A circuit board is provided in which peeling strength is prevented from decreasing and a connection resistance to a conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has a metal film for covering a through hole on at least one surface of an insulating substrate having the through hole filled with the conductive material. An uneven layer with a thickness of 5 μm or more is formed on a surface of the metal film, and a metal layer is formed on the opposite surface to the uneven layer.
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