Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Homayoun Talieh0
Date of Patent
April 3, 2007
Patent Application Number
11241281
Date Filed
September 29, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A chemical mechanical polishing apparatus includes a rotating plate on which a substrate received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to control the rate of material removed by the pad.
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