Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Richard J. Webb0
Bhaskar V. Velamakanni0
Christopher J. Rueb0
Date of Patent
April 3, 2007
0Patent Application Number
112879410
Date Filed
November 28, 2005
0Patent Primary Examiner
Patent abstract
A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
