Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kyoko Kuroki0
Hideaki Seto0
Date of Patent
April 10, 2007
Patent Application Number
11403137
Date Filed
April 11, 2006
Patent Primary Examiner
Patent abstract
A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
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