Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 17, 2007
Patent Application Number
10298225
Date Filed
November 18, 2002
Patent Primary Examiner
Patent abstract
A low k dielectric layer is formed by depositing an unset dielectric layer on a substrate, the dielectric layer including Silicon, Carbon and Oxygen. The surface of the dielectric layer exposed to an activated gas to form a semi-permeable skin on or of the surface of the layer. The layer is then cured to render at least part of the layer porous.
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