Patent attributes
A multi-layer printed circuit board (PCB) includes a first wire layer, a middle layer above the first wire layer, a second wire layer above the middle layer, and a slanting via formed in the middle layer and the second wire layer. The manufacturing method includes the steps of providing a first wire layer and forming a first wiring on the first wire layer, forming a middle layer on the first wire layer, forming a second wire layer on the middle layer, forming a slanting via in the middle layer and the second wire layer wherein the direction of the slanting via is not orthogonal to the first and the second wire layers, forming a second wiring on the second wire layer by an etching method, and forming an electroplated layer in the via to connect the first wiring and the second wiring.
