Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 24, 2007
Patent Application Number
11073447
Date Filed
March 7, 2005
Patent Primary Examiner
Patent abstract
An integrated circuit (IC) package and IC assembly. The IC assembly comprises the IC package, an insulating substrate and an adhesive film. The IC package comprises a chip body and a plurality of bumps. The bumps are disposed on a first surface of the chip body, each bump having a patterned pressing surface. The insulating substrate comprises a plurality of electrode pads corresponding to the bumps. Each electrode pad has a second surface pressed on the pressing surface of each bump. The adhesive film is disposed between the IC package and the insulating substrate, for covering the bumps and the electrode pads.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
