Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seiji Andoh0
Date of Patent
April 24, 2007
0Patent Application Number
107669380
Date Filed
January 30, 2004
0Patent Primary Examiner
Patent abstract
A semiconductor device including a substrate having a main surface including a first area, a second area surrounding the first area, and a third area surrounding the second area; a first insulating protective film that is provided in the first area and formed in a shape having no angles; a second insulating protective film provided in the third area; a semiconductor chip that is provided on the first insulating protective film and has a bottom surface facing to the first insulating protective film; and a sealing resin covering the semiconductor chip, wherein the bottom surface of the semiconductor chip covers the first area.
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