A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps:arranging separated components on a surface-adhesive film at a predefined contact-specific spacing from one another,embedding the components in a flexible material in order to form a flexible holding frame which holds the components,pulling off the film,producing contact-making elements on the exposed side of the components,performing a functional test of the components and, if necessary, repair and/or replacement of components, andfixing and making contact with the components held in the holding frame on the module carrier.