Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yutaka Kaneda0
Date of Patent
May 1, 2007
0Patent Application Number
100286240
Date Filed
December 20, 2001
0Patent Primary Examiner
Patent abstract
A process for manufacturing a multilayer flexible wiring board, which allows individual layers of wiring boards to be precisely positioned and to be readily stacked. A mask for exposure is prepared in which a plurality of pattern holes corresponding to individual layers of wiring boards of a multilayer flexible wiring board are arranged in the direction perpendicular to the transporting direction P of substrate. This mask for exposure is used to form a plurality of wiring patterns corresponding to individual layers of wiring boards of a multilayer flexible wiring board on the same sheet-like substrate.
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