Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 1, 2007
Patent Application Number
11128306
Date Filed
May 13, 2005
Patent Primary Examiner
Patent abstract
A semiconductor chip package is formed by a first semiconductor chip and a second semiconductor chip, which have electrodes for wiring at surfaces thereof, being integrated and mounted in a state in which reverse surfaces thereof oppose one another. Therefore, two semiconductor chips can be freely combined and mounted regardless of chip sizes thereof, and lengths of wires can be shortened. Thus, a wire-bonding yield can be improved, and a semiconductor package having excellent electric characteristics can be obtained.
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