Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 8, 2007
0Patent Application Number
108171380
Date Filed
April 2, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The invention is directed to a fluxing curative for curing an underfill that comprises an epoxy resin and for fluxing a solder during a solder assembly of an electronic component to an electronic device substrate and a method for producing the fluxing curative. Specifically, the fluxing curative comprises a salt that is a reaction product of an imidazole component and a carboxylic acid component having at least 10 carbon atoms per molecule. Additionally, the invention is directed to an underfill solution comprising the fluxing curative and a method of attaching an integrated circuit device using the underfill solution.
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