US Patent 7214565 Manufacturing method of an electronic part built-in substrate
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Patent abstract
A manufacturing method of an electronic part built-in substrate is disclosed, wherein an electronic part is contained in a build-up layer, the manufacturing method including
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US Patent 07214565 Manufacturing method of an electronic part built-in substrate US Patent 7214565 Manufacturing method of an electronic part built-in substrate
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Patent Number
0721456500
Patent Number
721456500
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Golden AI
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Is a
Patent Jurisdiction
Patent Number
072145650
Date of Patent
May 8, 2007
0Patent Application Number
112037000
Date Filed
August 15, 2005
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
072145650
Date of Patent
May 8, 2007
0Patent Application Number
112037000
Date Filed
August 15, 2005
0Official Website
Patent Primary Examiner
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Golden AI
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US Patent 07214565 Manufacturing method of an electronic part built-in substrate
Infobox
Is a
Patent jurisdiction
Patent number
07214565
Date of patent
May 8, 2007
Patent application number
11203700
Date Filed
August 15, 2005
Patent primary examiner
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