Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 8, 2007
Patent Application Number
10832895
Date Filed
April 27, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an enclosure for routing the cooling liquid into heat transfer contact with the heat sink and its fins.
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