Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kentarou Shimayama0
Masaru Nikaido0
Satoshi Ishikawa0
Date of Patent
May 22, 2007
0Patent Application Number
107584200
Date Filed
January 16, 2004
0Patent Primary Examiner
Patent abstract
A spacer assembly has first and second spacers that are set up integrally on first and second surfaces, respectively, of a substrate. Each spacer is tapered toward its extended end. In forming the spacer assembly, first and second molding dies having through holes coated with a parting agent that contains an organic component are prepared, and these molding dies are located on the first and second surfaces of the substrate so as to be intimately in contact with them, individually. Thereafter, a spacer forming material is filled into the through holes of the molding dies and cured, whereupon the first and second spacers are formed integrally on the substrate surfaces.
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