Patent attributes
A power delivery system delivers a relatively constant voltage to a microprocessor with low inductance and low resistance. The system includes a motherboard, an integrated circuit (IC) mounted on one side of the motherboard, a capacitor bank mounted on the opposite side of the motherboard; and a power converter mounted on the side of the motherboard opposite the IC. The IC contains a microprocessor that receives power from the power converter and capacitor bank. A short electrical path between components is achieved by locating the power converter and the capacitor bank on the side of the motherboard opposite the IC. By shortening the electrical path, the system reduced the inductance and resistance created by the electrical traces. The components of the system are compressed together. Instead of utilizing long traces or specialized parts to connect the power converter to the motherboard, a compressive interface is positioned between the power converter, the capacitor bank and the motherboard. The compressive interface includes conductive materials that facilitate the flow of electricity between the various components. The compressive interface prevents excessive inductance and resistance between the power converter, the capacitor bank, and the motherboard.
