US Patent 7223026 Solder-free packaging for integrated fiber optics device

Techniques for packaging in an optical device and an opto-electrical conversion device are disclosed. According to one aspect of the techniques, the optical device is packaged in a piece of tubing and the opto-electrical conversion device is packaged in a TO-can. While the optical device and the opto-electrical conversion device are coaxially aligned, the tube and the TO-can are integrated by a certain amount of epoxy that is later cured by a UV light or heat. As a result, an integrated optical device is formed and enjoys features of small footprint, better alignment, enhanced impact performance, lower cost in addition to easier manufacturing process and environmental-safe.