US Patent 7223694 Method for improving selectivity of electroless metal deposition
Patent 7223694 was granted and assigned to Intel on May, 2007 by the United States Patent and Trademark Office.
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Patent abstract
A method of depositing a metal cladding on conductors in a damascene process is described. The potential between, for instance, cobalt ions in electroless solution and the surface of an ILD between the conductors is adjusted so as to repel the metal from the ILD.
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US Patent 07223694 Method for improving selectivity of electroless metal deposition US Patent 7223694 Method for improving selectivity of electroless metal deposition
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Patent Number
0722369400
Patent Number
722369400
Edits on 26 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072236940
Date of Patent
May 29, 2007
0Patent Application Number
104591310
Date Filed
June 10, 2003
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072236940
Date of Patent
May 29, 2007
0Patent Application Number
104591310
Date Filed
June 10, 2003
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
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US Patent 07223694 Method for improving selectivity of electroless metal deposition
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07223694
Date of patent
May 29, 2007
Patent application number
10459131
Date Filed
June 10, 2003
Patent primary examiner
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