Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 5, 2007
Patent Application Number
10445669
Date Filed
May 27, 2003
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A molding die assembly includes an upper die and a lower die, wherein at least one of the upper and lower dies is provided with a cavity corresponding to the shape of a rubber member to be molded, wherein at least one of the upper and lower dies is provided with an annular projection around a cavity. The distance between the upper and lower dies at the annular projection is made smaller than the distance between the opposed surface portions, other than the cavity, of the upper and lower dies. A rubber member produced by the above mentioned molding die assembly is also provided.
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