Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ryo Ogawa0
Shoji Kusano0
Naohiro Fujita0
Date of Patent
June 5, 2007
Patent Application Number
10846599
Date Filed
May 17, 2004
Patent Primary Examiner
Patent abstract
An epoxy resin curing agent composition containing a ketimine compound prepared by the reaction between a polyoxypropylenediamine component and a ketone compound, wherein (1) the polyoxypropylenediamine component is a 9/1 to 6/4 (by weight) mixture of polyoxypropylenediamine having a molecular weight of 200 and 500 and polyoxypropylenediamine having a molecular weight of 1000 to 3000, (2) the ketimine compound has a degree of ketimination of 90% or higher, or (3) the reaction is carried out in the presence of a catalyst selected from (i) a combination of a tertiary amine and a sulfonic acid and (ii) a salt between a tertiary amine and a sulfonic acid.
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