Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Atsuhito Noda0
Shigeyuki Hoshikawa0
Yasuhiro Ichijo0
Date of Patent
June 12, 2007
0Patent Application Number
111398460
Date Filed
May 27, 2005
0Patent Primary Examiner
Patent abstract
Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
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