Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Byoung Young Kang0
Date of Patent
June 12, 2007
0Patent Application Number
107512120
Date Filed
December 30, 2003
0Patent Primary Examiner
Patent abstract
A method for packaging a semiconductor device wherein a chip is interconnected with a substrate by performing a flip-chip bonding by using an Au bump formed on a bond pad of the chip. In the method, a wire-bonding process and a molding process using an epoxy molding compound are not required. Further, a process of attaching solder balls to the substrate is not required, which eliminates subsequent flux printing and deflux processes. Accordingly, a packaging process of the semiconductor device becomes simplified and therefore the cost of the semiconductor device is decreased.
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