Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Abayomi I. Owei0
Eric Yakobson0
Hiep X. Nguyen0
Date of Patent
June 19, 2007
0Patent Application Number
106191980
Date Filed
July 14, 2003
0Patent Primary Examiner
Patent abstract
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
