US Patent 7232529 Polishing compound for chemimechanical polishing and polishing method
Patent 7232529 was granted and assigned to Hitachi on June, 2007 by the United States Patent and Trademark Office.
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Patent abstract
This invention provides a polishing medium for CMP, comprising an oxidizing agent, a metal-oxide-dissolving agent, a protective-film-forming agent, a water-soluble polymer, and water, and a polishing method making use of this polishing medium. Also, it is preferable that the water-soluble polymer has a weight-average molecular weight of 500 or more and the polishing medium has a coefficient of kinetic friction of 0.25 or more, a Ubbelode's viscosity of from 0.95 mPa·s (0.95 cP) to 1.5 mPa·s (1.5 cP) and a point-of-inflection pressure of 5 kPa (50 gf/cm2).
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US Patent 07232529 Polishing compound for chemimechanical polishing and polishing method US Patent 7232529 Polishing compound for chemimechanical polishing and polishing method
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Patent Number
0723252900
Patent Number
723252900
Edits on 22 Mar, 2023
Golden AI
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Current Assignee
Patent Jurisdiction
Patent Number
072325290
Date of Patent
June 19, 2007
0Patent Application Number
100694040
Date Filed
August 25, 2000
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072325290
Date of Patent
June 19, 2007
0Patent Application Number
100694040
Date Filed
August 25, 2000
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
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US Patent 07232529 Polishing compound for chemimechanical polishing and polishing method
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07232529
Date of patent
June 19, 2007
Patent application number
10069404
Date Filed
August 25, 2000
Patent primary examiner
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