US Patent 7232741 Wafer dividing method
Patent 7232741 was granted and assigned to Disco Corporation on June, 2007 by the United States Patent and Trademark Office.
All edits
A method of dividing a wafer along predetermined dividing lines, comprising the steps of a deteriorated layer forming step for applying a pulse laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers in the inside of the wafer along the dividing lines; an extensible protective tape affixing step for affixing an extensible protective tape to one side of the wafer before or after the deteriorated layer forming step; and a dividing step for dividing the wafer along the deteriorated layers by expanding the protective tape affixed to the wafer after the deteriorated layer forming step.
US Patent 07232741 Wafer dividing method US Patent 7232741 Wafer dividing method
US Patent 07232741 Wafer dividing method
Find more entities like US Patent 7232741 Wafer dividing method
