Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kazuhiko Ohmuro0
Masaru Suzuki0
Yoshiki Nitta0
Date of Patent
June 26, 2007
0Patent Application Number
111118600
Date Filed
April 22, 2005
0Patent Primary Examiner
Patent abstract
A lift-off procedure is provided which enables prevention of damage to a wiring pattern caused by contact of a metal being peeled off from a wafer with a wiring pattern at a time of lift-off procedure. A wafer having a surface on which a pattern is formed which contains a pattern portion to be removed is soaked into a chemical liquid at an angle at which the surface faces downward.
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