US Patent 7235422 Device packages
Patent 7235422 was granted and assigned to Agere Systems on June, 2007 by the United States Patent and Trademark Office.
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Patent Inventor Names
Hugo Fernando Safar0
Jeffrey John Gilbert0
John M. Brennan0
John William Osenbach0
Joseph Michael Freund0
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Patent abstract
Devices such as amplifiers are built on a heat sink having a perimeter wall surrounding active electronic devices. Surprisingly formation of wire bonds to such devices tends to be degraded if they have an aspect ratio greater than 2:1. This problem is overcome by forming wire bonds before such walls have a height of 30 mils and after bond formation extending the walls to their final height.
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Official Website
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US Patent 07235422 Device packages US Patent 7235422 Device packages
Infobox
Patent Number
072354220
Patent Number
72354220
Edits on 23 Sep, 2022
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
072354220
Date of Patent
June 26, 2007
0Patent Application Number
110492460
Date Filed
February 2, 2005
0Official Website
Patent Primary Examiner
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US Patent 07235422 Device packages
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07235422
Date of patent
June 26, 2007
Patent application number
11049246
Date Filed
February 2, 2005
Patent primary examiner
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