Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hubert Moriceau0
Olivier Rayssac0
Sébastien Kerdiles0
Benjamin Scarfogliere0
Christophe Maleville0
Christophe Morales0
Corinne Maunand Tussot0
Date of Patent
June 26, 2007
Patent Application Number
10832267
Date Filed
April 27, 2004
Patent Primary Examiner
Patent abstract
A method for bonding semiconductor structures together is described. The technique includes providing a bonding surface on each of two semiconductor structures, brushing a bonding surface of at least one of the structures to remove contaminants and to activate hydroxyl groups on the bonding surface to enhance hydrophilicity and to facilitate molecular bonding of the structures, and joining the bonding surfaces together by molecular bonding to form a composite structure.
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