Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
June 26, 2007
Patent Application Number
10931917
Date Filed
September 1, 2004
Patent Primary Examiner
Patent abstract
A package for integrated circuits is described. The package has a package substrate with a land side and an opposite die side, a first set of low level signal connectors on the die side to connect to an IC to be carried by the package, and a second set of low level signal connectors on the die side to connect to external components. The package may have power connectors on the land side or a power supply attached to the land side. A heat spreader or cooler may be attached to the die side.
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