Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 3, 2007
Patent Application Number
11182844
Date Filed
July 18, 2005
Patent Primary Examiner
Patent abstract
According to the present invention, a method for fabricating a three-dimensional acceleration sensor, comprising: providing a semiconductor substrate having first and second surfaces; forming an insulating layer on the first surface of the semiconductor substrate; forming an active layer on the insulating layer; forming a plurality of openings on the active layer at a first region, which is to be located above a movable mass with a predetermined space; selectively removing the insulating layer located under the first region in a wet-etching process through the plurality of openings; and selectively removing the active layer to form a groove separating the first region from a movable mass.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
