Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 3, 2007
Patent Application Number
10540249
Date Filed
December 17, 2003
Patent Primary Examiner
Patent abstract
Provided is a method of manufacturing an electronic part having a plurality of wiring patterns and an insulating layer interposed between the wiring patterns and serving to establish electrical connection between the wiring patterns through an interlayer connecting portion penetrating the insulating layer. In the method, a first step of forming a wiring pattern and a columnar conductor and a second step of forming a layer having a uniform thickness by bonding an insulating sheet from above and pressing the insulating sheet to the height of the columnar conductor with the columnar conductor as a stopper so as to conform the thickness of the insulating sheet to the height of the columnar conductor are repeated.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.