Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
July 3, 2007
Patent Application Number
10895947
Date Filed
July 22, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat radiation plate and the heat generation element through the bonding member; and a resin mold. The heat radiation block has a thickness in a range between 0.5 mm and 1.5 mm. The semiconductor device has high reliability of the bonding member.
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